HP PageWide T1195i to transform Thimm
5 December 2022
‘We want to drive forward the digitalisation of the entire supply chain, including beyond the packaging industry.’
Thimm
Highcon completes IPO
30 November 2020
$45 million raised, with proceeds to be put towards further solidifying the company’s commitment to the packaging marketplace.
Thimm installs unique corrugated laser cutting
17 January 2020
Highcon Beam 2C augments pack’n’display plant in Czech Republic.