Creative Edge has made two tutorials available on its website to demonstrate the new bump displacement feature
Creative Edge has released version 4.1 of its iC3D packaging design software.
Among a range of updates designed to further augment the photorealistic capabilities, the new version includes bump displacement – also known as displacement mapping – which enables packaging creatives to create and visualise emboss or deboss design features to a photorealistic standard in minutes. It means that designers can achieve the same visual effect with an Illustrator file using the same software that performs every other packaging design visualisation application.
The development is of particular relevance to the luxury and security packaging sectors where unique and complex shapes in glass, plastic and carton are used to distinguish premium products and ensure that they are more difficult to copy.
According to CEO Nick Gilmore, the beauty of the bump displacement feature is its simplicity and speed. ‘Luxury brands use selective embossing and debossing to convey a higher pedigree for their products. It’s the very complexity of producing the packaging that distinguishes it from regular high street brands,’ he explained.
He concluded, ‘We pride ourselves on having the most versatile – and affordable – packaging design application on the market, and this is yet another step towards making the best capabilities available to all.’
