Packaging converting specialist Highcon is to introduce new versions of its Euclid and Beam laser-based cutting and creasing systems at drupa 2020.
Highcon debuted on the packaging market at drupa 2012 with the first-generation Euclid, and introduced the Beam platform at drupa 2016 alongside upgrades to Euclid within the context of speed, customisation and workflow integration.
At drupa 2020, Highcon is to place a focus on ‘agile production’, specifically targeting the needs of the folding carton and corrugated markets for various format, application and speed requirements.
A key launch is that of the Beam 2C, for POS and short runs of corrugated packaging. Beam 2C can handle board sizes of 760 x 1060mm (B1) and with a 4mm thickness (C flute and double wall). It can process up to 4000sph. A non-stop configuration will become available later in 2020.
Germany-based Thimm Group is already working with a Highcon Beam 2C. Leoš Máslo, the converter’s POS and POP project manager within its pack’n’display business, said, ‘Our goal is to always provide customers with the best solution, whether for packaging or displays. We are convinced that digital technology is affecting the entire industry, and everyone should be taking advantage of the benefits. We are definitely excited about the new machine and the impact it will have on increasing the overall efficiency of our different businesses.’
Another already working with the Beam 2C is Orora Fibre Packaging Australasia, whose technical general manager Martyn Johnson added, ‘We have been working with Highcon on digital finishing for corrugated for three years and are constantly discovering more benefits of this innovative technology. We are seeing great interest and excitement from large brand owners in the potential of digital finishing, which offers far more capabilities than normal die-cutting, both in terms of the cutting and also the ability to produce both short and long runs rapidly without waiting for a die cutting tool. This substantially improves overall manufacturing efficiencies.’
The Highcon Euclid 5C will also target the needs of the corrugated packaging market, although at a slightly slower speed and board thickness (2250sph B1/2750sph B2, and 1-3mm).
Other Highcon systems available are: Beam 2, for folding carton, commercial print and thin corrugated applications (5000sph B1, 200 microns up to 2mm); Euclid 5 for folding carton and commercial print applications (2250sph B1/2750sph B2, and 200-600 microns); and Euclid 5S for folding carton and commercial print applications (2750sph B2, and 200-600 microns).
drupa 2020 will also allow Highcon to introduce its new CEO, Shlomo Nimrodi, to the market.
Read the January/February issue of Digital Labels & Packaging for more from Highcon, Mr Nimrodi and CMO Aviv Ratzman, as well as other early news from those using drupa 2020 as a springboard into the next decade; register here for free to receive all six issues of the magazine in 2020, and beyond
